Browse Prior Art Database

Use of a Composite Metal Pad for Wirebond Connection to the Copper Core of a Metal Core Substrate Circuit Board

IP.com Disclosure Number: IPCOM000037993D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-31
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Chiles, TH: AUTHOR

Abstract

The present invention utilizes a composite metal wirebond pad for the purpose of connection to the ground plane on a copper core thermal substrate board. As shown in the single figure, a copper core heat sink 10 is provided which has attached thereon a dielectric 12, carrying a tri-layer of a copper 14, nickel 16 and gold 18 or other wirebondable metallurgy. A bond pad 20, which is a pad of aluminum 22 claded onto a copper base 24, is attached by solder 26 onto the heat sink 10 through a window in the dielectric 12. The pad 20 is cut or stamped from commercially available aluminum claded copper sheets.

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Use of a Composite Metal Pad for Wirebond Connection to the Copper Core of a Metal Core Substrate Circuit Board

The present invention utilizes a composite metal wirebond pad for the purpose of connection to the ground plane on a copper core thermal substrate board. As shown in the single figure, a copper core heat sink 10 is provided which has attached thereon a dielectric 12, carrying a tri-layer of a copper 14, nickel 16 and gold 18 or other wirebondable metallurgy. A bond pad 20, which is a pad of aluminum 22 claded onto a copper base 24, is attached by solder 26 onto the heat sink 10 through a window in the dielectric 12. The pad 20 is cut or stamped from commercially available aluminum claded copper sheets.

The pad 20 is connected to the tri-layer or other wirebondable metallurgy with an aluminum wire 28. This avoids undesirable electrical effects (such as tunnel diode and jitter) experienced when an aluminum wire is bonded directly to copper.

Disclosed anonymously.

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