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Oscillating Electrodes for Anodizing/Electroplating Deep Channel Surfaces

IP.com Disclosure Number: IPCOM000037996D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-31
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Galyon, GT: AUTHOR [+3]

Abstract

Disclosed is an electrode design for uniformly anodizing or electroplating the surfaces of deep, narrow channels.

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This is the abbreviated version, containing approximately 89% of the total text.

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Oscillating Electrodes for Anodizing/Electroplating Deep Channel Surfaces

Disclosed is an electrode design for uniformly anodizing or electroplating the surfaces of deep, narrow channels.

Uniform anodizing or electroplating inside deep, narrow channels is difficult due to the fact that ionic current in the electrolyte used for anodizing or electroplating takes the path of least resistance. The result is that the anodized layer or electroplating is thinnest at the channel bottom, with the thickness increasing towards the channel opening. Another difficulty with deep channels is poor electrolyte concentration control inside channels due to the lack of stirring action inside the channels.

Uniform anodized layer (or electroplate) is obtained if the ionic charge delivery and the electrolyte concentration across the surface being anodized (or electroplated) are uniform. These two conditions are ensured by the oscillating electrode design described in the figure.

The ionic current is restricted to a small area 10 in the channel by means of an electrode 11 consisting of a narrow insulating box 12 open on the bottom and closed at the top by a metal piece 14 such as lead. The small area at the opening at the bottom of the box to which the ionic current is restricted is oscillated between the channel bottom and top to ensure uniform ionic charge delivery. Electrolyte concentration is kept constant at the opening at the bottom of the box by pumping the electrolyte down betwe...