Browse Prior Art Database

Sleeve Cap for Edge-Connected Modules

IP.com Disclosure Number: IPCOM000038050D
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-31
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Gow, J: AUTHOR [+3]

Abstract

A low cost sleeve cap is used to contain edge-connected semiconductor modules. Module insertion into the sleeve cap and application of standard materials for protecting and encapsulating modules and micro circuit chips is performed inexpensively.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

Sleeve Cap for Edge-Connected Modules

A low cost sleeve cap is used to contain edge-connected semiconductor modules. Module insertion into the sleeve cap and application of standard materials for protecting and encapsulating modules and micro circuit chips is performed inexpensively.

Referring to Fig. 1, an edge-connected circuit module is comprised of a micro circuit chip 2 affixed to wiring substrate 4 having a series of edge-connectors 6. The circuit module is shown being inserted into aluminum sleeve cap 8. Indentations 10 in cap 8 serve as guides for positioning and holding substrate 4.

Referring to end cross section Fig. 2, substrate 4 is fully inserted into cap 8. A silicone gel 12 is next injected into cap 8 to fill between chips 2 and substrate 4 as well as the regions between chips 2 and cap 8. Next, a tight fitting preformed pliable plug 14 is inserted. An epoxy resin 16 is injected and allowed to flow and then harden to complete the module mounting as shown in Fig. 2.

Disclosed anonymously.

1