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Selective Connection of Circuit Elements in Multilayer Ceramic Structure

IP.com Disclosure Number: IPCOM000038051D
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-31
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Gow, J: AUTHOR [+3]

Abstract

To permit connection of selected lines within a multilayer ceramic (MLC) circuit, special openings are provided in a top ceramic layer exposing solderable line ends. Selected connection is made by placing solder balls on exposed ends of the lines to be connected and then reflowing the solder.

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Selective Connection of Circuit Elements in Multilayer Ceramic Structure

To permit connection of selected lines within a multilayer ceramic (MLC) circuit, special openings are provided in a top ceramic layer exposing solderable line ends. Selected connection is made by placing solder balls on exposed ends of the lines to be connected and then reflowing the solder.

Referring to the figure, an upper circuit pattern of solderable lines 2 on an MLC module 4 and covered by ceramic layer 6 except in small regions A and B has a solder ball placed in region A. Placement is achieved by any of several means, e.g., a mask or sieve having an opening over region A but no opening over region B permits a solder ball to drop into region A. Solder is then reflowed to connect line ends exposed in region A.

This method is especially useful in making appropriate connections to partially good semiconductor chips mounted to MLC modules.

Disclosed anonymously.

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