Browse Prior Art Database

Cable Attached Surface Mount Package

IP.com Disclosure Number: IPCOM000038060D
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-31
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Capwell, RJ: AUTHOR [+3]

Abstract

Disclosed is a surface mount package that utilizes metalized ceramic and flex circuit cabling. This package takes advantage of present ceramic "C4" chip mounting and flex circuit attributes such as thermal flexibility, mounting configuration, and circuit design. The ceramic substrate's thermal properties are better utilized by the inverted mounting. Other benefits include increased number of circuit lines available per given area and population of both sides of circuit board.

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Cable Attached Surface Mount Package

Disclosed is a surface mount package that utilizes metalized ceramic and flex circuit cabling. This package takes advantage of present ceramic "C4" chip mounting and flex circuit attributes such as thermal flexibility, mounting configuration, and circuit design. The ceramic substrate's thermal properties are better utilized by the inverted mounting. Other benefits include increased number of circuit lines available per given area and population of both sides of circuit board.

Referring to the figure, a ceramic substrate 1 is metalized with a circuit pattern to support the desired chip. The ceramic substrate is attached to the chip 2 by reflowing of solder already on the chip. The ceramic cap 3 is epoxied over the chip 2 for protection and a stand-off. A flex circuit 4 is designed to support the metalized ceramic substrate 1. The flex circuit 4 is soldered to the substrate 1 already prepared for solder reflow. The flex circuit 4 has windows etched through the insulation for soldering to the circuit lines on the ceramic substrate 1 and circuit board 5 which is designed to support the flex circuit requirements. This package is now assembled to the circuit board 5 by adhesive 6 to give the required final package integrity. The flex circuit 4 is then soldered to the circuit board 5 to the circuit lines already prepared for solder reflow. The ceramic substrate 4 can have the thermal properties enhanced by attaching a heat sink 7 if...