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Copper Paste Formulations for Multilayer Ceramic (MLC) Applications

IP.com Disclosure Number: IPCOM000038064D
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-31
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Hibler, LB: AUTHOR [+3]

Abstract

1) A copper paste composed of the following ingredients provides good feature resolution and pattern adhesion when screened on ceramic sheets: 81 - 87 % Copper Powder 11 - 17 % Isobutyrate and Ethyl Cellulose 0 - 1 % Detergent 0 - 1 % Castor Oil Polymer 2) The following copper paste, which contains a glass frit, enhances adhesion of the copper paste to the ceramic - (via holes and patterns): 81 - 85 % Blend of Copper Powder and Glass Frit (max. of 10 % frit, by volume, in blend) 13 - 17 % Isobutyrate and Ethyl Cellulose 0 - 1 % Detergent 0 - 1 % Castor Oil Polymer

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Copper Paste Formulations for Multilayer Ceramic (MLC) Applications

1) A copper paste composed of the following ingredients provides good feature resolution and pattern adhesion when screened on ceramic sheets: 81 - 87 % Copper Powder

11 - 17 % Isobutyrate and Ethyl Cellulose

0 - 1 % Detergent

0 - 1 % Castor Oil Polymer

2) The following copper paste, which contains a glass frit, enhances adhesion of the copper paste to the ceramic - (via holes and patterns): 81 - 85 % Blend of Copper Powder and Glass Frit (max. of 10 % frit, by volume, in blend) 13 - 17 % Isobutyrate and Ethyl Cellulose

0 - 1 % Detergent

0 - 1 % Castor Oil Polymer

Disclosed anonymously.

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