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Metallurgy for I/O Pin Attachment

IP.com Disclosure Number: IPCOM000038065D
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-31
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Palmateer, PH: AUTHOR [+2]

Abstract

Nickel/gold plated Kovar (1) or Invar (2) I/O pins can be joined to substrates utilizing low tin solder alloys (5%-10% tin) with the following metallurgy evaporated on the substrate surface: o Ceramic substrate - 500 Angstroms Zr, 4 Microns Ni, 5000 Angstroms Au or 500 Angstroms Ti, 4 Microns Ni, 5000 Angstroms Au. o Polyimide coated ceramic - 500 Angstroms Cr, 4 Microns Ni, 5000 Angstroms Au.

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Metallurgy for I/O Pin Attachment

Nickel/gold plated Kovar (1) or Invar (2) I/O pins can be joined to substrates utilizing low tin solder alloys (5%-10% tin) with the following metallurgy evaporated on the substrate surface: o Ceramic substrate - 500 Angstroms Zr, 4 Microns Ni, 5000 Angstroms Au or 500 Angstroms Ti, 4 Microns Ni, 5000 Angstroms Au. o Polyimide coated ceramic - 500 Angstroms Cr, 4 Microns Ni, 5000 Angstroms Au.

The tin lead joining metallurgy can either be evaporated over the substrate surface metallurgy or provided in the form of .060" x .001" preforms.

Pin pull strength utilizing this structure exceeds requirements of 9 pounds. Also, the absence of copper in the evaporated surface metal structure eliminates exposed copper at the pad edges which can corrode. (1) Trademark of Westinghouse. (2) Trademark of Creusot-Loire.

Disclosed anonymously.

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