Browse Prior Art Database

Burn-In Cooling Hat for Thermal Conduction Modules

IP.com Disclosure Number: IPCOM000038070D
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-31
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Aakalu, NG: AUTHOR

Abstract

The cooling device disclosed is for selectively operating certain chips on a multi-chip thermal conduction cooled module at a relatively higher temperature than the rest of the chips during module burn-in operation.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

Burn-In Cooling Hat for Thermal Conduction Modules

The cooling device disclosed is for selectively operating certain chips on a multi-chip thermal conduction cooled module at a relatively higher temperature than the rest of the chips during module burn-in operation.

When a mix of chip technologies, such as bipolar and CMOS, are present on the same module, the burn-in temperatures for each technology in general would be different. The cooling hat described here provides such a cooling environment during the burn-in process.

The thermal resistance between the chips and the cold plate 10 in the burn-in hat 20 will be made larger for the higher burn-in temperature chips. The larger values can be obtained by using a thermally inferior metal, such as stainless steel, in place of copper or aluminum for pistons or equivalent conduction elements 30 of the hat. Other means include larger gap between the hat and the pistons 40, conical shaped piston end to increase the effective thermal contact resistance between the chips and the pistons. Also use of lower spring constant spring 50 will increase the thermal contact resistance between the chip and the piston/conduction element 30.

(Image Omitted)

Disclosed anonymously.

1