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Seeding-Permanent Resist System using Polymer Interdiffusion

IP.com Disclosure Number: IPCOM000038139D
Original Publication Date: 1989-Nov-01
Included in the Prior Art Database: 2005-Jan-31
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Seraphim, DP: AUTHOR [+3]

Abstract

This application refers to the technology of printed circuit boards, where a major goal is to plate directly on a catalyzed surface and use permanent resist for circuitization purposes.

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Seeding-Permanent Resist System using Polymer Interdiffusion

This application refers to the technology of printed circuit boards, where a major goal is to plate directly on a catalyzed surface and use permanent resist for circuitization purposes.

The objective is a seed/permanent resist/epoxy system with enhanced adhesion of the circuit lines and minimized leakage between them. This is achieved by applying a blanket seed layer on epoxy laminate, then on top a permanent resist followed by a process of interdiffusion between the 2 organic polymer layers (photoresist-epoxy) which effectively immobilize the metal particles. The above objectives were demonstrated by application of the Kirkendahl effect in specially prepared laminate structures, in which optimized interdiffusion effectively buried the seed particles. These structures were built in a laminar configuration as shown in Figure 1 where a layer of catalyst particles (Pd-Sn colloid) was flanked on both sides by epoxy layer, and resist layer respectively.

The samples were laminated at different temperatures and then subjected to high energy particle irradiation at Cornell University. The RBS technique was applied to follow the relative motion of the markers by the back scattering process.

In summary, it was found that on laminated samples treated to 160oC the Pd- Sn particles markers moved into the epoxy indicating a good degree of interdiffusion. Therefore, this proves that after lamination the Pd-Sn seed is ...