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Two Thermally Conductive Adhesives for Heat Sink Attachment that are Completely Removable

IP.com Disclosure Number: IPCOM000038148D
Original Publication Date: 1989-Nov-01
Included in the Prior Art Database: 2005-Jan-31
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Booth, RB: AUTHOR [+4]

Abstract

Disclosed are two materials for the temporary attachment of heat sinks to chips for high performance cooling, that are stable in a boiling fluorocarbon environment and completely removable.

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This is the abbreviated version, containing approximately 87% of the total text.

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Two Thermally Conductive Adhesives for Heat Sink Attachment that are Completely Removable

Disclosed are two materials for the temporary attachment of heat sinks to chips for high performance cooling, that are stable in a boiling fluorocarbon environment and completely removable.

Photoresist may be used to attach heat sinks to chips. It is commercially available in thin sheets which contribute to a very controllable, yet low thermal resistance. For ease of application to an array of chips, the photoresist may be exposed and developed, so that all that is left is an array of discrete adhesive shapes. To simplify placing these shapes on all chips simultaneously, the shapes may be located on the chip pitch. To vary the thermal performance of different chip sites, different material thickness or shapes may be used. The material is also stable in a boiling fluorocarbon environment. It is also completely removable with common industrial solvents.

An adhesive compound of polybuthdiene, filled with aluminum nitride, and cured with dicumyl peroxide, may also be used for the temporary attachment of heat sinks to chips. After this material is sandwiched between the chips and the heat sinks, the assembly is cured at an elevated temperature. It forms a good mechanical and thermal bond that is stable in a boiling flurorcarbon environment. After soaking the assembly in an appropriate solvent bath, the heat sinks and adhesive are completely removable. The thermal conductivity and...