Browse Prior Art Database

Bi-Level Integrated System Structure

IP.com Disclosure Number: IPCOM000038166D
Original Publication Date: 1989-Dec-01
Included in the Prior Art Database: 2005-Jan-31
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Dietsch, HE: AUTHOR [+3]

Abstract

Integrated circuit (IC) chips are mounted in a package having thermal expansion equal to that of the chips. An electrical distribution system within the package provides ground and voltage planes plus signal wiring over the ground plane to provide impedance matching. The package has covers which provide environmental protection and good heat transfer. Provision for pressure connecting flex cable is included in the package design. This packaging system structure thus provides opportunity to use any of several chip connecting technologies, including solder reflow, environmental protection with good thermal dissipation, and impedance matched wiring for high speed signal transmission.

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Bi-Level Integrated System Structure

Integrated circuit (IC) chips are mounted in a package having thermal expansion equal to that of the chips. An electrical distribution system within the package provides ground and voltage planes plus signal wiring over the ground plane to provide impedance matching. The package has covers which provide environmental protection and good heat transfer. Provision for pressure connecting flex cable is included in the package design. This packaging system structure thus provides opportunity to use any of several chip connecting technologies, including solder reflow, environmental protection with good thermal dissipation, and impedance matched wiring for high speed signal transmission.

Referring to the figure, IC chip 2 is attached by reflowed solder pads 4 to circuit wiring 6 on insulating layer 8 disposed over and around a copper 10, invar 12, copper 14 core which serves as a ground plane. Conductive layer 16 carries supply voltage Vdd. Connection from Vdd plane 16 to wiring level 6 is made by via connector 18. Thickness of the copper, insulation, and invar layers are selected to provide a thermal expansion match of the packaging system with thermal expansion of IC chip 2. Environmental protection covers 20 and 22 are good thermal conductors which may make thermal connection with chip 2 and/or component 24 via a thermally conductive gel 26. Fastener 28 holds the packaging system together and applies appropriate pressure on gasket...