Browse Prior Art Database

ESD Shield for EC Wires

IP.com Disclosure Number: IPCOM000038181D
Original Publication Date: 1989-Dec-01
Included in the Prior Art Database: 2005-Jan-31
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Asselta, JA: AUTHOR [+2]

Abstract

Variations in the relative height of a twisted pair EC wire with respect to an electrical reference plane in the board can drastically affect the electrostatic discharge immunity.

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ESD Shield for EC Wires

Variations in the relative height of a twisted pair EC wire with respect to an electrical reference plane in the board can drastically affect the electrostatic discharge immunity.

A solution to this problem is to provide a metal-coated sheet of very thin plastic, for example, a Mylar (registered Trademark of EI duPont) film which is pressed onto the board by foam inserts in the back cover, or by an air bladder in the back cover. The plastic film is next to the board to avoid short circuits, and the metal layer is electrically connected to the reference or ground plane in the board. The reference plane for the wires would accordingly be only the thickness of the plastic, e.g., 0.002 inches from the wires.

Disclosed anonymously.

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