Browse Prior Art Database

Lamination Pad for Use in High Temperature Laminations

IP.com Disclosure Number: IPCOM000038182D
Original Publication Date: 1989-Dec-01
Included in the Prior Art Database: 2005-Jan-31
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Loomis, JR: AUTHOR [+3]

Abstract

Disclosed is a composite pad that is presently being used in high temperature laminations (>650 degrees F.) This pad consists entirely of PTFE (such as Teflon, trademark of E.I. DuPont de Nemours and Co.) and copper and becomes compliant at temperatures exceeding 650 degrees F. The main purpose of this lamination pad is to distribute the pressure forces evenly over the entire work surface and to assist in the filling of any holes or cavities required by the new high technology programs. The pad is reusable and following is a diagram of its make-up.

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Lamination Pad for Use in High Temperature Laminations

Disclosed is a composite pad that is presently being used in high temperature laminations (>650 degrees F.) This pad consists entirely of PTFE (such as Teflon, trademark of E.I. DuPont de Nemours and Co.) and copper and becomes compliant at temperatures exceeding 650 degrees F. The main purpose of this lamination pad is to distribute the pressure forces evenly over the entire work surface and to assist in the filling of any holes or cavities required by the new high technology programs. The pad is reusable and following is a diagram of its make-up.

Disclosed anonymously.

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