Browse Prior Art Database

Precured Low Dielectric Materials for Use in High Performance Boards

IP.com Disclosure Number: IPCOM000038183D
Original Publication Date: 1989-Dec-01
Included in the Prior Art Database: 2005-Jan-31
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Samuelson, CE: AUTHOR

Abstract

Disclosed is a new concept of using pre-cured low dielectric materials between conventional FR-4 type power and signal planes.

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Precured Low Dielectric Materials for Use in High Performance Boards

Disclosed is a new concept of using pre-cured low dielectric materials between conventional FR-4 type power and signal planes.

The high temperature precured low dielectric materials comprise PTFE (such as Teflon (E.I. DuPont)) and woven glass cloth. These materials are laminated at high temperatures (>650 degrees F) and then placed in a composite board.

Composite boards can be manufactured with dielectric constants down to 2.5 vs. 4.0 for conventional FR-4 type composites.

The resulting composites are dimensionally stable due mainly to the glass reinforcement and the precuring of the low dielectric constant layers.

A typical schematic diagram of a composite board containing the low dielectric constant layers between power and signal layers is shown below.

Disclosed anonymously.

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