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Magnetic Film Disk With Dielectric Underlayer

IP.com Disclosure Number: IPCOM000038216D
Original Publication Date: 1989-Dec-01
Included in the Prior Art Database: 2005-Jan-31
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Howard, JK: AUTHOR [+3]

Abstract

Disclosed is a film-disk structure for magnetic recording applications, which incorporates an insulating oxide underlayer with a crystalline structure. Such disks exhibit suitable magnetic characteristics for longitudinal recording and offer potential performance advantages, for example, enhanced durability.

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Magnetic Film Disk With Dielectric Underlayer

Disclosed is a film-disk structure for magnetic recording applications, which incorporates an insulating oxide underlayer with a crystalline structure. Such disks exhibit suitable magnetic characteristics for longitudinal recording and offer potential performance advantages, for example, enhanced durability.

The use of non-magnetic support layers in magnetic disk fabrication is well- known. It is typical to incorporate a sputtered underlayer (most commonly 100- 5000 Angstroms of chromium) to improve the recording characteristics of the magnetic film. In addition to magnetic considerations, the underlayer can impart mechanical strength to the film disk structure and certain situations arise where an insulating material is desirable. The use of amorphous dielectrics, such as Al2O3, SiO2 or Ta2O5, tend to induce a c-axis orientation in Co-alloy magnetic recording layers resulting in degraded in-plane properties for longitudinal recording. It is found, however, that cubic crystalline ZrO2 as an underlayer produces excellent in-plane properties in the subsequent magnetic layer. Experimental data has shown that the bulk magnetic properties of ternary Co- based films are quite similar for films deposited on chromium or zirconia underlayers in the thickness range 350-2000 Angstroms. High coercive force and saturation squareness can be achieved, with acceptable coercivity squareness depending on the thickness and deposition co...