Browse Prior Art Database

Vertical Immersion Solder Machine

IP.com Disclosure Number: IPCOM000038339D
Original Publication Date: 1987-Jan-01
Included in the Prior Art Database: 2005-Jan-31
Document File: 2 page(s) / 61K

Publishing Venue

IBM

Related People

Kohn, H: AUTHOR [+2]

Abstract

Immersion solder is a process in which connectors are attached to a printed circuit board (PCB) by applying solder to the board while the board and solder are immersed in a heated flux bath. A method of accomplishing this process in a vertical machine is described in the following. A PCB 1 to be immersion soldered is loaded in board-loading rack 2 in a vertical position where an overhead conveyor 3 picks up the board 1 and transports it to a flux tank 4 which holds a process heating bath. As the board 1 is lowered into the flux tank 4, it passes a degassing nozzle 5 located below the flux surface 6 where nozzle 5 forces hot process flux through board plated-through holes (PTHs), pushing out air that was trapped in the PTHs.

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Vertical Immersion Solder Machine

Immersion solder is a process in which connectors are attached to a printed circuit board (PCB) by applying solder to the board while the board and solder are immersed in a heated flux bath. A method of accomplishing this process in a vertical machine is described in the following. A PCB 1 to be immersion soldered is loaded in board-loading rack 2 in a vertical position where an overhead conveyor 3 picks up the board 1 and transports it to a flux tank 4 which holds a process heating bath. As the board 1 is lowered into the flux tank 4, it passes a degassing nozzle 5 located below the flux surface 6 where nozzle 5 forces hot process flux through board plated-through holes (PTHs), pushing out air that was trapped in the PTHs. The PCB 1 is moved from the overhead conveyor 3 to an indexing conveyor 7 that serves as a preheat buffer to elevate the temperature of the PCB 1 as it is moved in the direction of a solder nozzle 8. At the bottom of flux tank 4 a solder pot 9 liquifies the solder so that it may be pumped up by positive displacement gears (not seen) to the solder nozzle 8 where the PCB 1 is soldered. The nozzle 8 forces solder over all solder pads and drives solder into the PTHs, while the PCB 1 is raised vertically past the solder nozzle 8 by conveyor 3. A solder squeegee 10 is a nozzle which levels off the solder pads and prevents bridging of solder pads by jetting flux from the bath at an angle and velocity onto the soldere...