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Technique for Selectively Electroplating Pad Terminals on a Multilayer Ceramic Substrate

IP.com Disclosure Number: IPCOM000038440D
Original Publication Date: 1987-Jan-01
Included in the Prior Art Database: 2005-Jan-31
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Mondou, E: AUTHOR [+3]

Abstract

This article describes the formulation of a conductive paste used to electrically common ceramic substrate surface features as part of the electroplating process. In this process, a unique gold paste is screened on selected areas on the substrate. The gold paste consists of Metz Gold* #708, particle size of 3.6 microns, 89% by weight and vehicle #514, 11% by weight. The resultant paste has a viscosity of 61.0 KCP. * Trademark of Hysol Corporation.

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Technique for Selectively Electroplating Pad Terminals on a Multilayer Ceramic Substrate

This article describes the formulation of a conductive paste used to electrically common ceramic substrate surface features as part of the electroplating process. In this process, a unique gold paste is screened on selected areas on the substrate. The gold paste consists of Metz Gold* #708, particle size of 3.6 microns, 89% by weight and vehicle #514, 11% by weight. The resultant paste has a viscosity of 61.0 KCP. * Trademark of Hysol Corporation.

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