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Browse Prior Art Database

Membrane Solder Seal/Membrane Epoxy Seal

IP.com Disclosure Number: IPCOM000038541D
Original Publication Date: 1987-Jan-01
Included in the Prior Art Database: 2005-Jan-31
Document File: 2 page(s) / 25K

Publishing Venue

IBM

Related People

DiPaolo, N: AUTHOR [+3]

Abstract

In semiconductor processing, modules are manufactured wherein a hermetic seal is made between the cap and substrate. The seal is subjected to strains during thermal cycling because of the dissimilar materials from which the cap and substrate are made, and because of the different rates of heat transfer in the cap and substrate. This can result in defects. This invention proposes soldering (or use of epoxy adhesive) to affix a metallic membrane between the cap and the substrate, which would then become the seal. The membrane-seal would absorb most of the thermal strains to be experienced without the seal's being broken. The membrane may be manufactured from a solder-coatable material, such as Cu, Ni, Ni-plated Cu, Ni-plated INCONEL*, or a clad metal system.

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Membrane Solder Seal/Membrane Epoxy Seal

In semiconductor processing, modules are manufactured wherein a hermetic seal is made between the cap and substrate. The seal is subjected to strains during thermal cycling because of the dissimilar materials from which the cap and substrate are made, and because of the different rates of heat transfer in the cap and substrate. This can result in defects. This invention proposes soldering (or use of epoxy adhesive) to affix a metallic membrane between the cap and the substrate, which would then become the seal. The membrane-seal would absorb most of the thermal strains to be experienced without the seal's being broken. The membrane may be manufactured from a solder-coatable material, such as Cu, Ni, Ni-plated Cu, Ni-plated INCONEL*, or a clad metal system. The main requirement is the membrane must have solderability if it is to be soldered. The configuration of the membrane solder seal is shown in the figure. The solder (or epoxy) 2 attaches the membrane 3 to the cap 1 and the substrate 4. The membrane may be soldered to the subtrate and cap in one furnace reflow step, although more than one step may be desirable. Stand-offs are not required because the joint is supported by a metallic, spring-like material. The joint can be made with substantial pressure on the surfaces to be joined. The pressure will depend upon the stiffness designed into the membrane. A major advantage of the invention is that it permits use of metal c...