Browse Prior Art Database

Rework Tool for Surface-Mounted-Type Components

IP.com Disclosure Number: IPCOM000038551D
Original Publication Date: 1987-Feb-01
Included in the Prior Art Database: 2005-Jan-31
Document File: 2 page(s) / 45K

Publishing Venue

IBM

Related People

Klein, KV: AUTHOR

Abstract

A process is described which utilizes condensation heating as the method of reflowing the solder connection for the purpose of replacing individual components on a surface-mounted circuit board. It operates at temperatures similar to the original manufacturing process; therefore, the components, flux, etc., are already qualified to withstand this process. The process employs the device, shown in the figure, which operates as follows: 1. A boiler 1 containing FC-70 is a type of Flournert produced by 3M Corporation. FC-70 or some similar heat transfer material, is heated to boil and provides a positive pressure. 2. During the reflow cycle the FC-70 vapor is released from the boiler through a control value 2 and a flexible hose to a reflow nozzle 3.

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Rework Tool for Surface-Mounted-Type Components

A process is described which utilizes condensation heating as the method of reflowing the solder connection for the purpose of replacing individual components on a surface-mounted circuit board. It operates at temperatures similar to the original manufacturing process; therefore, the components, flux, etc., are already qualified to withstand this process. The process employs the device, shown in the figure, which operates as follows: 1. A boiler 1 containing FC-70 is a type of Flournert produced by 3M Corporation. FC-70 or

some similar heat transfer material, is heated to

boil and provides a positive pressure. 2. During the reflow cycle the FC-70 vapor is released from the boiler through a control value 2

and a flexible hose to a reflow nozzle 3. This

flow of hot vapor will heat the solder to release

the component from the card. Installation of the

new component would be the reverse of this

process. 3. This reflow process would be performed with

the card and the reflow nozzle immersed in a vapor

blanket of FREON* or some similar solvent. As the

FC-70 is released, it would be captured in the

FREON vapor, thus preventing the loss of the FC-70

which is very expensive. 4. The FREON blanket would be generated and controlled as in a standard vapor degreaser. 5. Through use of the machine the concentration of FC-70 will build up in the FREON boil sump.

Periodically, the FREON can be drained and

distilled to reclaim the FC-...