Browse Prior Art Database

Surface-Mountable Connected System

IP.com Disclosure Number: IPCOM000038677D
Original Publication Date: 1987-Feb-01
Included in the Prior Art Database: 2005-Jan-31
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Hebert, TM: AUTHOR [+2]

Abstract

An improvement to the component mounting arrangement described in U.S. Patent 3,647,533 is described. The method of producing bonding bumps described in that print generally comprise the steps of: 1. affixing a patterned mask to the substrate onto which bonding bumps are to be placed, and 2. depositing metallic conductive material through the mask and onto the substrate. The general method encompasses a number of embodiments, particularly including: 1. the deposition of copper onto a conductive layer previously located on the substrate; 2.

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Surface-Mountable Connected System

An improvement to the component mounting arrangement described in U.S. Patent 3,647,533 is described. The method of producing bonding bumps described in that print generally comprise the steps of: 1. affixing a patterned mask to the substrate onto which bonding bumps are to be placed, and 2. depositing metallic conductive material through the mask and onto the substrate. The general method encompasses a number of embodiments, particularly including: 1. the deposition of copper onto a conductive layer previously located on the substrate; 2. the three-step deposition of at least two metallic conductive materials onto the substrate;

the first step comprising deposition of a first

metal to a desired thickness, the second step

comprising code position of the first metal and a

second metal, and the third step comprising

deposition of the second metal only, the process

producing a phased metallized gradient structure;

and 3. the production of a solder dipped bump by

subjecting the bumps produced in (1) and (2)

immediately above to a solder dip bath. In the present arrangement wire bonders (as used in the semiconductor industry) can be used to fabricate "bump" contacts for concentrating contact force.

If gold boning wire is used with a gold-plated mate, no further processing is required. With copper wire, both the wire bond and pad, as well as the mating contact, should be tin plated.

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