Browse Prior Art Database

Edge Connector Module for Memory Devices

IP.com Disclosure Number: IPCOM000038682D
Original Publication Date: 1987-Feb-01
Included in the Prior Art Database: 2005-Jan-31
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Engle, SR: AUTHOR [+3]

Abstract

In an electronic package that has a chip mounted on a ceramic substrate by C-4 solder balls, a layer of polyimide screened over the entire substrate (except for the chip site) can provide two functions. First, the layer of polyimide can act as a solder dam for the C-4 interconnections. Second, the polyimide can act as an Alpha particle barrier, thereby eliminating the need for a separate barrier layer.

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Edge Connector Module for Memory Devices

In an electronic package that has a chip mounted on a ceramic substrate by C-4 solder balls, a layer of polyimide screened over the entire substrate (except for the chip site) can provide two functions. First, the layer of polyimide can act as a solder dam for the C-4 interconnections. Second, the polyimide can act as an Alpha particle barrier, thereby eliminating the need for a separate barrier layer.

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