Browse Prior Art Database

Semi-Automatic Stacking Tool for Dual-Inline-Pin Semiconductor Modules

IP.com Disclosure Number: IPCOM000038802D
Original Publication Date: 1987-Mar-01
Included in the Prior Art Database: 2005-Feb-01
Document File: 2 page(s) / 73K

Publishing Venue

IBM

Related People

Boccio, JM: AUTHOR [+5]

Abstract

A semi-automatic tool is used for the purpose of stacking one dual-inline-pin (DIP) semiconductor package on top of another prior to soldering the stacked set into a single stacked DIP package. DIPs are delivered to a stacker tool in plastic tubes and manually loaded into separate bottom and top module unload magazines located at opposite ends of the tool, as shown in the top view figure of the stacker. During tool operation, empty tubes are dropped automatically into holding chutes awaiting manual removal. Empty carrier racks are manually loaded into the tool and are shown at positions A and B, and the filled carrier racks at positions F and G are manually removed. Carrier racks at positions C and E are at DIP-loading stations.

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Semi-Automatic Stacking Tool for Dual-Inline-Pin Semiconductor Modules

A semi-automatic tool is used for the purpose of stacking one dual-inline-pin (DIP) semiconductor package on top of another prior to soldering the stacked set into a single stacked DIP package. DIPs are delivered to a stacker tool in plastic tubes and manually loaded into separate bottom and top module unload magazines located at opposite ends of the tool, as shown in the top view figure of the stacker. During tool operation, empty tubes are dropped automatically into holding chutes awaiting manual removal. Empty carrier racks are manually loaded into the tool and are shown at positions A and B, and the filled carrier racks at positions F and G are manually removed. Carrier racks at positions C and E are at DIP-loading stations. At position C a rack is loaded with bottom modules, while the rack at position E is being loaded with top modules. The carrier at position D is at a manual station where spacer combs are inserted after the bottom modules are in place. Carrier racks move automatically from position A through G in the DIP package-stacking process. Bottom and top DIP packages are fed by gravity from am inclined tube unloaders on to separate moving pick-up belts, as shown in the figure. A one-at-a-time gate (singulater) meters DIP modules into cylinder-operated spacing traps at the end of each pick-up belt until five parts are in place and ready to be picked up automatically and placed in a fifty pocket carrier rack assembly. At the bottom module loading station C, a pick- up head is lowered automatically and a vacuum pick-up is initiated. The head is raised with the five DIPs and transported on the load head transport rails to the first row of a ten-column frame (5 rows x 10 columns). This process is repeated until the ten rows of a carrier are full. The top module loading station E pick-up head operates...