Browse Prior Art Database

Selective Tape Automated Bonding Beam Electroplating Machine

IP.com Disclosure Number: IPCOM000038867D
Original Publication Date: 1987-Mar-01
Included in the Prior Art Database: 2005-Feb-01
Document File: 2 page(s) / 54K

Publishing Venue

IBM

Related People

Ledermann, PG: AUTHOR [+2]

Abstract

This article describes a technique for gold plating on beam tape without a common electrode and with area sensitivity. Tape for tape automated bonding uses a common electrode for gold plating. This requires area on the tape for interconnections. Common electrode plating wastes gold and covers all exposed surfaces. In the technique disclosed herein, a combined electrically common multibeam probe contact and flowing plating solution allows gold electroplating on beam ends. Fig 1a is a detail view of the beam tape plating machine utilizing this technique. Fig. 1b is an exploded view of the working area of the machine of Fig 1a. Using the tape plating machine of Fig. 1, it is possible to plate different metals on different beams on the same tape, if desired. Fig.

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Selective Tape Automated Bonding Beam Electroplating Machine

This article describes a technique for gold plating on beam tape without a common electrode and with area sensitivity. Tape for tape automated bonding uses a common electrode for gold plating. This requires area on the tape for interconnections. Common electrode plating wastes gold and covers all exposed surfaces. In the technique disclosed herein, a combined electrically common multibeam probe contact and flowing plating solution allows gold electroplating on beam ends. Fig 1a is a detail view of the beam tape plating machine utilizing this technique. Fig. 1b is an exploded view of the working area of the machine of Fig 1a. Using the tape plating machine of Fig. 1, it is possible to plate different metals on different beams on the same tape, if desired. Fig. 2 is a detail view of the beam tape plating machine illustrating the technique of this disclosure for bump plating.

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