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Browse Prior Art Database

Stacked Module on 2 Sides of a Carrier

IP.com Disclosure Number: IPCOM000038869D
Original Publication Date: 1987-Mar-01
Included in the Prior Art Database: 2005-Feb-01
Document File: 2 page(s) / 62K

Publishing Venue

IBM

Related People

Franck, DR: AUTHOR

Abstract

Multiple pin carriers 1 are surface solder attached by the pins 2 to the conductive pads (not shown) on one side (Fig. 1) or both sides (Fig. 2) of a major carrier, e.g., a printed circuit board 3 either concurrently or independently. The assembly increases density and improves packaging performance. The carrier 1 is typically a printed circuit and made of plastic. The peripheral pins 2 are formed with pad feet 4 so as to be easily attachable to the carrier 1. The pins extend up the plastic carrier so that chip-carrying substrates, e.g., ceramic substrate 5, of various types can be slid over the pins. Several substrates can be stacked. The pins are then peripherally soldered to solder-filled gaps on the edges of the substrate carrying the chip.

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Stacked Module on 2 Sides of a Carrier

Multiple pin carriers 1 are surface solder attached by the pins 2 to the conductive pads (not shown) on one side (Fig. 1) or both sides (Fig. 2) of a major carrier, e.g., a printed circuit board 3 either concurrently or independently. The assembly increases density and improves packaging performance. The carrier 1 is typically a printed circuit and made of plastic. The peripheral pins 2 are formed with pad feet 4 so as to be easily attachable to the carrier 1. The pins extend up the plastic carrier so that chip-carrying substrates, e.g., ceramic substrate 5, of various types can be slid over the pins. Several substrates can be stacked. The pins are then peripherally soldered to solder-filled gaps on the edges of the substrate carrying the chip.

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