Browse Prior Art Database

Wafer Pick-Up Tool

IP.com Disclosure Number: IPCOM000038938D
Original Publication Date: 1987-Mar-01
Included in the Prior Art Database: 2005-Feb-01
Document File: 2 page(s) / 39K

Publishing Venue

IBM

Related People

Cook, LG: AUTHOR [+3]

Abstract

A molded wafer pick-up tool has been designed which greatly reduces the need for operator dexterity required with conventional vacuum pencils. The tool uses the existing slots in the wafer boat to provide self-orientation prior to its picking up the wafer. The manual pick-up of semiconductor wafers from wafer carriers requires great dexterity on the part of the operator so as to not contact adjoining wafers with the pick-up tool, nor the wafer in transport. The new tool uses the wafer boat slots for controlled access which means the wafer is not touched until the tool is in place. This greatly reduces scratching and other damage which may occur to the wafer when vacuum pencils are used for pick-up.

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Wafer Pick-Up Tool

A molded wafer pick-up tool has been designed which greatly reduces the need for operator dexterity required with conventional vacuum pencils. The tool uses the existing slots in the wafer boat to provide self-orientation prior to its picking up the wafer. The manual pick-up of semiconductor wafers from wafer carriers requires great dexterity on the part of the operator so as to not contact adjoining wafers with the pick-up tool, nor the wafer in transport. The new tool uses the wafer boat slots for controlled access which means the wafer is not touched until the tool is in place. This greatly reduces scratching and other damage which may occur to the wafer when vacuum pencils are used for pick-up. A conventional vacuum pencil is attached to the molded wafer pick- up tool 5 via a threaded nipple 2 which is bonded or molded into the adapter section 4 of the pickup tool into which a ferrule fitting 3 of the vacuum pencil fits. A conduit hole 6 runs through the body to the vacuum port 7 of the flexible pad 8 which allows wafer pick-up by means of the vacuum. A reduced hinge area 9 allows the pad to move in place without touching the wafer, and then, when vacuum is applied, it will hinge toward the wafer for intimate contact and pick-up. This makes for a controlled pick-up minimizing operator skill. A limit button 10 or thin rib minimizes surface contact with the wafer without undue vacuum leakage. The entry rib 11 geometry matches that of the wafe...