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Improved Adhesive Applicator for Surface-Mounted Components

IP.com Disclosure Number: IPCOM000038964D
Original Publication Date: 1987-Mar-01
Included in the Prior Art Database: 2005-Feb-01
Document File: 2 page(s) / 35K

Publishing Venue

IBM

Related People

Koshy, R: AUTHOR [+2]

Abstract

A method is described to improve the efficiency of the adhesive dispensing procedure for surface-mounted components (SMC). The technical and economic feasibility of the dual-sided surface- mount process depends on developing an efficient adhesive-dispensing technique. The present trend in using one head on the pick and place machine to dispense adhesive and the other head to place the components, is time consuming. The method, shown in Fig. 1, involves a procedure to integrate the adhesive application process within the pick and place operation. The new process involves the following steps: 1. Pick up the components. 2. Transport component to adhesive station. .IN 5 3.

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Improved Adhesive Applicator for Surface-Mounted Components

A method is described to improve the efficiency of the adhesive dispensing procedure for surface-mounted components (SMC). The technical and economic feasibility of the dual-sided surface- mount process depends on developing an efficient adhesive-dispensing technique. The present trend in using one head on the pick and place machine to dispense adhesive and the other head to place the components, is time consuming. The method, shown in Fig. 1, involves a procedure to integrate the adhesive application process within the pick and place operation. The new process involves the following steps: 1. Pick up the components. 2. Transport component to adhesive station. .IN 5
3. Pick up adhesive on the back side

of the component by touching it on the adhesive

dispenser top en route to the placement point. Experimental results show that the new process using the vertical dispensing syringe can deliver more than 80 mils of dot height on the back side of the component. The dot height can be varied by programming the pressure application mechanism at the bottom of the syringe to change pressure based on height of the bottom of the component. Subsequent placement of the component on a panel shows good wetting.

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