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Browse Prior Art Database

Multilayer Interconnections

IP.com Disclosure Number: IPCOM000039090D
Original Publication Date: 1987-Apr-01
Included in the Prior Art Database: 2005-Feb-01
Document File: 2 page(s) / 21K

Publishing Venue

IBM

Related People

Dahmen, M: AUTHOR [+4]

Abstract

For avoiding line shorts in a plane caused by alignment tolerances of aperture masks used to produce interconnections between layers, which are known as vias, the bottom plane metal lines adjacent to the vias are recessed. Via 5 without alignment tolerances (solid line) and via 5' with alignment tolerances (broken line) connects top plane metal line 1 (solid line) to bottom plane metal line 2 (broken line). Recess 4 prevents via 5' with alignment tolerances from contacting and thus short-circuiting the adjacent line 3.

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Multilayer Interconnections

For avoiding line shorts in a plane caused by alignment tolerances of aperture masks used to produce interconnections between layers, which are known as vias, the bottom plane metal lines adjacent to the vias are recessed. Via 5 without alignment tolerances (solid line) and via 5' with alignment tolerances (broken line) connects top plane metal line 1 (solid line) to bottom plane metal line 2 (broken line). Recess 4 prevents via 5' with alignment tolerances from contacting and thus short-circuiting the adjacent line 3.

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