Browse Prior Art Database

Thermal Sponge

IP.com Disclosure Number: IPCOM000039093D
Original Publication Date: 1987-Apr-01
Included in the Prior Art Database: 2005-Feb-01
Document File: 2 page(s) / 27K

Publishing Venue

IBM

Related People

Kang, SK: AUTHOR [+3]

Abstract

A cooling structure for VLSI chips is disclosed and comprises a thermal sponge having a mixture of a solder and solid particles of a highly conductive pure metal, wherein the solder is chosen according to its melting point such that the melting point corresponds to the desired operating temperature of the chip. The thermal sponge is placed in a recess in a substrate and is directly adjacent to the location of where the chip is to be attached. The provided cooling structure is both conformal and highly thermally conductive as opposed to the rigid high thermal conductivity couplers of the art and the low thermal conductive conformal grease, cement or solder couplers of the art. The thermal sponge and cooling structure are seen in the figure.

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Thermal Sponge

A cooling structure for VLSI chips is disclosed and comprises a thermal sponge having a mixture of a solder and solid particles of a highly conductive pure metal, wherein the solder is chosen according to its melting point such that the melting point corresponds to the desired operating temperature of the chip. The thermal sponge is placed in a recess in a substrate and is directly adjacent to the location of where the chip is to be attached. The provided cooling structure is both conformal and highly thermally conductive as opposed to the rigid high thermal conductivity couplers of the art and the low thermal conductive conformal grease, cement or solder couplers of the art. The thermal sponge and cooling structure are seen in the figure. A heat sink or heat bus 10 is provided with a recess 20 which accommodates a thermal sponge 30 and a VLSI chip 40. The thermal sponge 30 is comprised of a mixture of a low melting point solder and highly conductive pure metal solid particles, with the solid particles representing a substantial fraction of the mixture. The particular solder chosen for the sponge is chosen because its melting point corresponds to the desired operating temperature of the VLSI chip. Thus, for example, for a desired melting point of 60oC, a solder of a 51In-35Bi-14Sn composition might be chosen, while for a melting point of 95oC, a solder of a 52.5Bi-32Pb-15.5Sn composition might be chosen. The solid particles chosen for the sponge ar...