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Thermal Conduction Module With Integrated Cold Plate and Individual Cylinders for Pistons

IP.com Disclosure Number: IPCOM000039184D
Original Publication Date: 1987-Apr-01
Included in the Prior Art Database: 2005-Feb-01
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Eid, JC: AUTHOR [+2]

Abstract

A Thermal Conduction Module (TCM) has a chip carrier and a metal structure called a hat that is attached to the chip carrier and forms part of an enclosure for chips on the chip carrier. Metal pistons are carried in the hat and are spring-loaded to contact the chips for heat transfer to the hat. In this TCM, the pistons are carried in metal cups that are located in holes in a metal support plate that forms the hat surface that faces the chips. The cups are brazed to the support plate. A cover is attached to the support plate to form an enclosure for chilled water that contacts the walls of the cups for cooling the pistons. The cups can be brazed to the support plate at angles to match any tilt in the chips with respect to the chip carrier.

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Thermal Conduction Module With Integrated Cold Plate and Individual Cylinders for Pistons

A Thermal Conduction Module (TCM) has a chip carrier and a metal structure called a hat that is attached to the chip carrier and forms part of an enclosure for chips on the chip carrier. Metal pistons are carried in the hat and are spring- loaded to contact the chips for heat transfer to the hat. In this TCM, the pistons are carried in metal cups that are located in holes in a metal support plate that forms the hat surface that faces the chips. The cups are brazed to the support plate. A cover is attached to the support plate to form an enclosure for chilled water that contacts the walls of the cups for cooling the pistons. The cups can be brazed to the support plate at angles to match any tilt in the chips with respect to the chip carrier. With this feature, the pistons can be given flat ends and will contact the chip over a wide area. A tool represents the height and tilt of each chip. It has a flat surface representing the surface of the chip carrier and it has three adjustable screws in each chip location. The completed chip carrier is automatically scanned to determine the height and tilt of the plane of each chip, and the screws for each chip position on the tool are adjusted to represent these planes. Each cup is given a point at the center of its closed cylindrical end, and a jig is provided with a corresponding array of conical holes. For assembling the hat, the int...