Browse Prior Art Database

Local Photoresist Removal Device

IP.com Disclosure Number: IPCOM000039404D
Original Publication Date: 1987-Jun-01
Included in the Prior Art Database: 2005-Feb-01
Document File: 2 page(s) / 39K

Publishing Venue

IBM

Related People

Haller, KA: AUTHOR [+2]

Abstract

The production of multilayer printed circuit boards requires laminating layers of photoresist and MYLAR* sheets to copper panels. During this process, the photoresist is bonded to the copper and the MYLAR remains on the other side of the photoresist to protect it from impurities. The MYLAR and the photoresist cover the entire board, including the four locating holes, which must remain clear in order to properly locate the boards. A device to remove the resist and MYLAR from the holes is described in the following. (Image Omitted) This device was developed as a means of spot removal of photoresist and MYLAR to free the locator holes. A cutting edge permitted to penetrate only the MYLAR was introduced to both sides of the board to detach a circular slug of MYLAR around the locator hole.

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Local Photoresist Removal Device

The production of multilayer printed circuit boards requires laminating layers of photoresist and MYLAR* sheets to copper panels. During this process, the photoresist is bonded to the copper and the MYLAR remains on the other side of the photoresist to protect it from impurities. The MYLAR and the photoresist cover the entire board, including the four locating holes, which must remain clear in order to properly locate the boards. A device to remove the resist and MYLAR from the holes is described in the following.

(Image Omitted)

This device was developed as a means of spot removal of photoresist and MYLAR to free the locator holes. A cutting edge permitted to penetrate only the MYLAR was introduced to both sides of the board to detach a circular slug of MYLAR around the locator hole. The photoresist, which is sensitive to ultraviolet light, was spot exposed, turning it very brittle. Once the MYLAR was separated from the board and the resist was exposed, a vacuum was locally introduced underneath the locator slot to draw the MYLAR and brittle photoresist on both sides of the panel through the locator slot and away from the panel. The debris passing through the hole was advantageous because that helped clean the hole out. The design for the local photoresist remove tool is illustrated in Figs. 1 and 2. Fig. 1 is a detailed view of Fig. 2. Circular cutting blades 1 (Fig. 1) are attached to an upper and lower steel tubular shafts 2 a...