Browse Prior Art Database

Robotic Hot Air Solder/Desolder Placement Device

IP.com Disclosure Number: IPCOM000039421D
Original Publication Date: 1987-Jun-01
Included in the Prior Art Database: 2005-Feb-01
Document File: 2 page(s) / 78K

Publishing Venue

IBM

Related People

Chu, KL: AUTHOR [+3]

Abstract

This article describes a device used with a robot to place, solder or desolder surface mount components automatically. Fig. 1 shows the device disclosed herein in partial cross-section. It is designed to place and solder surface mount components to a printed circuit (PC) board or to desolder the components and remove (Image Omitted) them during the rework process. In a soldering process, the vacuum pick up 1 picks up a component and places it on the PC board. Meanwhile, the component is encapsuled in the hot air chamber 2 of lower head assembly 3. Hot air flows from electric heater 4, passes through the passages in the upper head assembly and lower head assembly 3 and flows into the hot air chamber.

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Robotic Hot Air Solder/Desolder Placement Device

This article describes a device used with a robot to place, solder or desolder surface mount components automatically. Fig. 1 shows the device disclosed herein in partial cross-section. It is designed to place and solder surface mount components to a printed circuit (PC) board or to desolder the components and remove

(Image Omitted)

them during the rework process. In a soldering process, the vacuum pick up 1 picks up a component and places it on the PC board. Meanwhile, the component is encapsuled in the hot air chamber 2 of lower head assembly 3. Hot air flows from electric heater 4, passes through the passages in the upper head assembly and lower head assembly 3 and flows into the hot air chamber. After all the solder joints are heated to the reflow temperature in the hot air chamber, the electric heater will be turned off and the solder joints will then be allowed to freeze and cool down to the room temperature. The lower head assembly 3 is interchangeable so that it can accommodate different size components. A typical robotic hot air solder/desolder placement system is shown in Fig. 3. The system has four lower head assemblies which can be stored in a preheated station to keep them at operating temperature. Fig. 2 is a detail view of the gripper 7 in the upper head assembly 5. A spring-returned air cylinder in the upper head assembly is used to move the rod 6 up and down, so that the gripper can release and pic...