Browse Prior Art Database

Gas Electron Phosphor Display Package

IP.com Disclosure Number: IPCOM000039499D
Original Publication Date: 1987-Jun-01
Included in the Prior Art Database: 2005-Feb-01
Document File: 2 page(s) / 88K

Publishing Venue

IBM

Related People

Dickerson, JA: AUTHOR [+2]

Abstract

In the gas electron phosphor flat panel display package shown in the drawing, a low cost, deep-drawn aluminum case 10 provides a vacuum- tight, five-sided enclosure. The case is both lightweight and seamless. A flange 12 has been provided to permit ultrasonic seam welding to a copper flange 14 on a glass faceplate 16. Structural support between faceplate 16 and case 10 is provided by a molded epoxy cathode assembly 18. Internal spacers 20 withstand an atmospheric pressure of approximately one ton per square foot, permitting thin lightweight glass to be used for the faceplate 16. Cathode inserts 32 are retained between the spacers 20 in assembly 18. Two-part epoxy compounds, having very low outgassing characteristics as well as a low thermal coefficient of expansion, were chosen for the cathode assembly.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Gas Electron Phosphor Display Package

In the gas electron phosphor flat panel display package shown in the drawing, a low cost, deep-drawn aluminum case 10 provides a vacuum- tight, five-sided enclosure. The case is both lightweight and seamless. A flange 12 has been provided to permit ultrasonic seam welding to a copper flange 14 on a glass faceplate 16. Structural support between faceplate 16 and case 10 is provided by a molded epoxy cathode assembly 18. Internal spacers 20 withstand an atmospheric pressure of approximately one ton per square foot, permitting thin lightweight glass to be used for the faceplate 16. Cathode inserts 32 are retained between the spacers 20 in assembly 18. Two-part epoxy compounds, having very low outgassing characteristics as well as a low thermal coefficient of expansion, were chosen for the cathode assembly. Cavities in the mold accommodate cathode resistors 22, bus bar 24, alignment springs, such as spring 26, and alignment pins 28. A monolithic grid structure 30 serves as the electron control element. Sandwiched metalized polyimide film is used for each layer. Two process steps are required per layer. The first step is an etch of the conductive grid pattern, and the second step is an etch of the hole pattern in the polyimide film.

1

Page 2 of 2

2

[This page contains 3 pictures or other non-text objects]