Browse Prior Art Database

Edge Photoresist Development Process and Exposure TOOL

IP.com Disclosure Number: IPCOM000039502D
Original Publication Date: 1987-Jun-01
Included in the Prior Art Database: 2005-Feb-01
Document File: 2 page(s) / 30K

Publishing Venue

IBM

Related People

Agnihotri, RK: AUTHOR [+3]

Abstract

Residual photoresist remaining on the edge of a substrate is developed and removed in a solution to keep the edge of the substrate free of excess photoresist for the precise positioning of the subsequent mask plate. A knife-edge contact point tool is placed over the substrate to permit the exposure of only the edge without affecting the remaining photoresist layer placed on the substrate. A two-step development process is used to remove residual photoresist from the edges of the substrate for the precise positioning of the mask plate for the second development process. The photoresist layer is deposited onto the substrate by a spin process. A tool, such as shown in Figs. l and 2, is placed over the substrate or a plurality of the substrates. As shown in Fig.

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Edge Photoresist Development Process and Exposure TOOL

Residual photoresist remaining on the edge of a substrate is developed and removed in a solution to keep the edge of the substrate free of excess photoresist for the precise positioning of the subsequent mask plate. A knife- edge contact point tool is placed over the substrate to permit the exposure of only the edge without affecting the remaining photoresist layer placed on the substrate. A two-step development process is used to remove residual photoresist from the edges of the substrate for the precise positioning of the mask plate for the second development process. The photoresist layer is deposited onto the substrate by a spin process. A tool, such as shown in Figs. l and 2, is placed over the substrate or a plurality of the substrates. As shown in Fig. l, the tool includes a flat plate l having a groove 2 cut through the plate l. Fig. 2 shows a cross- sectional view of the tool taken along lines A-A of Fig. l. The center section 3 of the tool includes knife edges 4 which contact the photoresist layer 5 of the substrate 6, thereby exposing only the top edges 7 of the substrate 6 through the grooves 2. By the use of the tool, only the edges 7 of the substrate 6 are exposed to an ultraviolet light to develop the layer 5 of photoresist placed onto the substrate. The substrate is then immersed in a solution, preferably of hydroxide and water, to remove the photoresist that was exposed by the ultraviolet lig...