Browse Prior Art Database

Plastic/Metal Hybrid Package

IP.com Disclosure Number: IPCOM000039593D
Original Publication Date: 1987-Jul-01
Included in the Prior Art Database: 2005-Feb-01
Document File: 2 page(s) / 31K

Publishing Venue

IBM

Related People

Shapiro, JB: AUTHOR

Abstract

Disclosed is a new plastic-metal hybrid mounting and encapsulation circuit package that provides stress isolation to semiconductor integrated circuit (IC) chips that are assembled utilizing surface-mounted and standard pin-in-hole technologies. It also provides for a balanced stress plastic packaging system. Many IC chips exhibit piezo-resistance sensitivity which results in unpredictable parametric changes and variations which cause undesirable circuit performance. This package prevents contact between the molding compound and the device, eliminating such problems. Referring to the figure, the package provides mechanical stress isolation to the IC chip 4 by providing a plastic or high expansion resin layer 2 of the appropriate thickness between the metal substrate 5 and the lead frame 3.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Plastic/Metal Hybrid Package

Disclosed is a new plastic-metal hybrid mounting and encapsulation circuit package that provides stress isolation to semiconductor integrated circuit (IC) chips that are assembled utilizing surface-mounted and standard pin-in-hole technologies. It also provides for a balanced stress plastic packaging system. Many IC chips exhibit piezo-resistance sensitivity which results in unpredictable parametric changes and variations which cause undesirable circuit performance. This package prevents contact between the molding compound and the device, eliminating such problems. Referring to the figure, the package provides mechanical stress isolation to the IC chip 4 by providing a plastic or high expansion resin layer 2 of the appropriate thickness between the metal substrate 5 and the lead frame 3. Isolation is also provided between the lead frame 3 and the metal cap assembly 1 by the resin coating 2. The application of appropriate heat and modest pressure in a simple press mold completes the seal before polymerization in a curing oven. This chip stress isolation technique is compatible with contemporary circuit assembly procedures and process equipment, including the chip-to-substrate bonding method.

1

Page 2 of 2

2

[This page contains 2 pictures or other non-text objects]