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Stable Bath for Fast Electroless Copper Deposition

IP.com Disclosure Number: IPCOM000039634D
Original Publication Date: 1987-Jul-01
Included in the Prior Art Database: 2005-Feb-01
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Junginger, R: AUTHOR [+2]

Abstract

In a bath containing a copper salt, ethylenediaminetetraacectic acid, sodium cyanide, a surfactant and formaldehyde (HCHO), the deposition rate is increased by increasing the HCHO content. Destabilization of the bath is prevented by dispersing a gas mixture, having a higher oxygen content than air, through the bath.

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Stable Bath for Fast Electroless Copper Deposition

In a bath containing a copper salt, ethylenediaminetetraacectic acid, sodium cyanide, a surfactant and formaldehyde (HCHO), the deposition rate is increased by increasing the HCHO content. Destabilization of the bath is prevented by dispersing a gas mixture, having a higher oxygen content than air, through the bath.

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