Browse Prior Art Database

Test Head for Substrates

IP.com Disclosure Number: IPCOM000039671D
Original Publication Date: 1987-Jul-01
Included in the Prior Art Database: 2005-Feb-01
Document File: 2 page(s) / 45K

Publishing Venue

IBM

Related People

Probst, K: AUTHOR [+2]

Abstract

The described test head for substrates has a design which is independent of the footprint of the substrates to be tested and therefore universally applicable. The new design does not require elaborate mechanical holding means, such as egg crates, stand-offs, etc., and permits positioning the contact wires (beams) at any point without interfering frames and/or bars. Fig. 1 is a sectional view of the new test head. Pointed wires 1 are arranged in a regular pattern in a guide plate 2. They are led without interruptions from plug 3 of the electrical test matrix to product 4. The contact wires are insulated by metal oxide rather than by organic resins previously used. A plate 3 with bores, the diameter of which is slightly larger than that of the bores in guide plate 2, is arranged above guide plate 2.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 78% of the total text.

Page 1 of 2

Test Head for Substrates

The described test head for substrates has a design which is independent of the footprint of the substrates to be tested and therefore universally applicable. The new design does not require elaborate mechanical holding means, such as egg crates, stand-offs, etc., and permits positioning the contact wires (beams) at any point without interfering frames and/or bars. Fig. 1 is a sectional view of the new test head. Pointed wires 1 are arranged in a regular pattern in a guide plate 2. They are led without interruptions from plug 3 of the electrical test matrix to product 4. The contact wires are insulated by metal oxide rather than by organic resins previously used. A plate 3 with bores, the diameter of which is slightly larger than that of the bores in guide plate 2, is arranged above guide plate 2. Wires 1 are thus able to buckle when being placed on substrate 4, which is necessary to compensate for height differences of the contact points 5. Above plate 3, there is a chamber 6 filled with a thermoplastic material 7. The thermoplastic material serves to mechanically fix contact wires 1. For repairing individual damaged wires, the mechanical fixation must be individually removable and restorable. The fixation is removed by resistance heating the respective wire 1, which softens the thermoplastic material in its immediate vicinity. In this state, the wire with a repair reserve 8, arranged in the upper portion 9 of test head housing 10, which...