Browse Prior Art Database

Direct Offset Process

IP.com Disclosure Number: IPCOM000039675D
Original Publication Date: 1987-Jul-01
Included in the Prior Art Database: 2005-Feb-01
Document File: 2 page(s) / 23K

Publishing Venue

IBM

Related People

Biedermann, E: AUTHOR

Abstract

This process uses an offset plate 1 interacting with a ribbon 2. Offset plate 1 is covered with a thin (1 È) lacquer layer 3 which is both electrically conductive and thermally fusible. Ribbon 2 consists of a resistive layer that is roughened on its surface 4 facing offset plate 1. If print head 5 is energized, a current flows in the direction of arrow 6 from print head 5 to offset plate 1, causing lacquer layer 3 in the region of the print head to be removed from offset plate 1 and to adhere to roughened surface 4 of ribbon 2. Thus, when offset plate 1 is printed, lacquer-free areas are obtained according to the information to be printed. After printing, offset plate 1 is ready for etching as usual.

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Direct Offset Process

This process uses an offset plate 1 interacting with a ribbon 2. Offset plate 1 is covered with a thin (1 È) lacquer layer 3 which is both electrically conductive and thermally fusible. Ribbon 2 consists of a resistive layer that is roughened on its surface 4 facing offset plate 1. If print head 5 is energized, a current flows in the direction of arrow 6 from print head 5 to offset plate 1, causing lacquer layer 3 in the region of the print head to be removed from offset plate 1 and to adhere to roughened surface 4 of ribbon 2. Thus, when offset plate 1 is printed, lacquer- free areas are obtained according to the information to be printed. After printing, offset plate 1 is ready for etching as usual.

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