Browse Prior Art Database

Organic Chip Package Module

IP.com Disclosure Number: IPCOM000039692D
Original Publication Date: 1987-Jul-01
Included in the Prior Art Database: 2005-Feb-01
Document File: 2 page(s) / 36K

Publishing Venue

IBM

Related People

Gruber, H: AUTHOR [+3]

Abstract

The described new module consists of four low-cost parts that are combined to form two subassemblies which can be assembled using existing manufacturing processes. The figure shows a pinned 2-power plane epoxy card 1 which is glued to a metal heat sink 2 to form one subassembly. Another epoxy card 3 with signal and power planes, which is personalized for the chip applications, and chip 4 are bonded together to form the other subassembly. After testing, this subassembly is soldered to the first subassembly. The chips inside the assembly, made up of the two subassemblies, are sealed from the aggressive environment by an aluminum cap 5 with an elastomeric cushion 6. Cushion 6 presses the chip against the heat sink for high-efficiency cooling. The new chip package module has a number of advantages.

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Organic Chip Package Module

The described new module consists of four low-cost parts that are combined to form two subassemblies which can be assembled using existing manufacturing processes. The figure shows a pinned 2-power plane epoxy card 1 which is glued to a metal heat sink 2 to form one subassembly. Another epoxy card 3 with signal and power planes, which is personalized for the chip applications, and chip 4 are bonded together to form the other subassembly. After testing, this subassembly is soldered to the first subassembly. The chips inside the assembly, made up of the two subassemblies, are sealed from the aggressive environment by an aluminum cap 5 with an elastomeric cushion 6. Cushion 6 presses the chip against the heat sink for high-efficiency cooling. The new chip package module has a number of advantages. - It requires short processes, thus ensuring a fast

turn around.

- The processes may be vendorized.

- All parts and subassemblies can be individually

tested to avoid expensive scrap.

- The pinned 2-power plane heat sink assembly

provides an additional parallel connection between

power pins, which reduces the voltage drop for the

voltage levels distributed in that assembly.

- Heat sink 2 prevents the signal of one pin being

coupled to another. It also reduces the series

inductance of each power and signal pin, thus

enhancing the module application for high-speed

logic interconnection.

- Shielded signal line distribution in the actual

chip carrier...