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Mounting Arrangement for Polymer-On-Aluminum Substrate of a Satellite Card on a Main Card

IP.com Disclosure Number: IPCOM000039745D
Original Publication Date: 1987-Jul-01
Included in the Prior Art Database: 2005-Feb-01
Document File: 2 page(s) / 54K

Publishing Venue

IBM

Related People

Harbour, WP: AUTHOR [+2]

Abstract

A satellite card having a polymer-on aluminum (POA) substrate is mounted on a main electronic card by soldering contact lands of the satellite card to contact lands on the main card to provide both low- cost, low-resistance electrical connectors and a mechanical connection between the two cards. A satellite card 1 (Fig. 1) has an aluminum substrate 2 (Fig. 2) with a layer 3 of polyamide secured to the aluminum substrate 2 by an adhesive 4. The polyamide layer 3 has a copper circuit layer 5 attached thereto by an adhesive 6. The copper circuit layer 5 is etched to have contact lands 7 (Fig. 1) connected to a component 8 mounted on a portion of the copper circuit layer 5 (Fig. 2). Prior to mounting the component 8 (Fig. 1), the satellite card 1 is formed with mounting feet 9 and 10.

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Mounting Arrangement for Polymer-On-Aluminum Substrate of a Satellite Card on a Main Card

A satellite card having a polymer-on aluminum (POA) substrate is mounted on a main electronic card by soldering contact lands of the satellite card to contact lands on the main card to provide both low- cost, low-resistance electrical connectors and a mechanical connection between the two cards. A satellite card 1 (Fig. 1) has an aluminum substrate 2 (Fig. 2) with a layer 3 of polyamide secured to the aluminum substrate 2 by an adhesive 4. The polyamide layer 3 has a copper circuit layer 5 attached thereto by an adhesive 6. The copper circuit layer 5 is etched to have contact lands 7 (Fig. 1) connected to a component 8 mounted on a portion of the copper circuit layer 5 (Fig. 2). Prior to mounting the component 8 (Fig. 1), the satellite card 1 is formed with mounting feet 9 and 10. The mounting feet 9 and 10 abut a main card 11, which has contact lands 12. The contact lands 7 of the satellite card 1 are soldered to the contact lands 12 on the main card 11 by use of a solder paste between the contact lands 7 and 12 and then passing the entire structure through a vapor phase reflow unit or an oven. During this soldering, the solder connecting the component 8 to a portion of the copper circuit layer 5 (Fig. 2) may reach its melting point. Accordingly, the component 8 (Fig. 1) requires additional means, such as an adhesive or cement, for bonding it to the satellite card 1. If des...