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Printed Circuit Board Through-Hole Inspection Using Video Camera

IP.com Disclosure Number: IPCOM000039767D
Original Publication Date: 1987-Aug-01
Included in the Prior Art Database: 2005-Feb-01
Document File: 2 page(s) / 42K

Publishing Venue

IBM

Related People

Takeo, Y: AUTHOR [+2]

Abstract

A video camera for through-hole inspection is provided with an integral pressing member which, at the time of inspection, is brought into contact with the multilayer printed circuit board under inspection to press it against the support plate. This technique serves to correct warp of the circuit board and suppress vibration of the camera, facilitating focusing of the camera. In the figure, the circuit board 10 to be inspected for epoxy smears in the through-holes is placed on a frosted glass support plate 12 with its underside illuminated by lamps 14. The video camera 16 is supported by a positioning device 22 capable of providing three dimensional positioning. The optical axis of the camera 16 is slanted with respect to vertical axis.

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Printed Circuit Board Through-Hole Inspection Using Video Camera

A video camera for through-hole inspection is provided with an integral pressing member which, at the time of inspection, is brought into contact with the multilayer printed circuit board under inspection to press it against the support plate. This technique serves to correct warp of the circuit board and suppress vibration of the camera, facilitating focusing of the camera. In the figure, the circuit board 10 to be inspected for epoxy smears in the through-holes is placed on a frosted glass support plate 12 with its underside illuminated by lamps 14. The video camera 16 is supported by a positioning device 22 capable of providing three dimensional positioning. The optical axis of the camera 16 is slanted with respect to vertical axis. A cylindrical pressing member 18 is attached to the camera 16 in alignment with the optical axis. In operation, the camera 16 is properly positioned with respect to a through-hole to be inspected and then lowered to cause the member 18 to press the circuit board 10 against the support plate 12. Contact pressure between the circuit board 10 and the member 18 is adjusted by a pressure adjusting mechanism 20. The pressing acts to fix the circuit board, correct warp of the circuit board and minimize vibration of the camera transmitted from the positioning device 50. Consequently, focused state can be automatically obtained by simply positioning the camera 16 to bring the...