Browse Prior Art Database

Modified MCP Packaging Structure

IP.com Disclosure Number: IPCOM000039899D
Original Publication Date: 1987-Aug-01
Included in the Prior Art Database: 2005-Feb-01
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Shivashankar, SA: AUTHOR

Abstract

A metallized ceramic polyimide packaging structure is disclosed and comprises: a ceramic substrate; a thin film Cr layer atop the ceramic; a copper layer atop the thin film chromium layer; a thin film Cr2O3 layer atop the copper layer; and a polyimide layer atop the thin film Cr2O3 layer. Typically, another metallized layer is included atop the polyimide layer, with the polyimide layer acting as a dielectric between the two copper layers. Vias connecting the metallized copper layers may be created in the polyimide of the disclosed packaging structure, and in accomplishing the same, the Cr2O3 layer may be etched in a pure CF4 or NF3 plasma at high rates and without any undercutting of the polyimide.

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Modified MCP Packaging Structure

A metallized ceramic polyimide packaging structure is disclosed and comprises: a ceramic substrate; a thin film Cr layer atop the ceramic; a copper layer atop the thin film chromium layer; a thin film Cr2O3 layer atop the copper layer; and a polyimide layer atop the thin film Cr2O3 layer. Typically, another metallized layer is included atop the polyimide layer, with the polyimide layer acting as a dielectric between the two copper layers. Vias connecting the metallized copper layers may be created in the polyimide of the disclosed packaging structure, and in accomplishing the same, the Cr2O3 layer may be etched in a pure CF4 or NF3 plasma at high rates and without any undercutting of the polyimide. Such results are in contrast to known packaging structures which use a thin film Cr layer atop the copper layer instead of the Cr2O3, and which require either a very slow ion beam etching process or a reactive ion etching process which undercuts the polyimide and which etches the Cr layer at a slower rate than is accomplished with the Cr2O3 layer provided herein. The disclosed metallized ceramic polyimide packaging structure basically includes a thick copper film sandwiched between a ceramic substrate and a polyimide layer with the polyimide layer acting as a dielectric when a first level of copper is added atop the polyimide. In order to promote the adhesion of the thick copper film to the ceramic and polyimide, additional thin layers...