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Method of Mounting Low-Cost Multiple Transistor Modules

IP.com Disclosure Number: IPCOM000039915D
Original Publication Date: 1987-Aug-01
Included in the Prior Art Database: 2005-Feb-01
Document File: 2 page(s) / 49K

Publishing Venue

IBM

Related People

Boler, VH: AUTHOR [+3]

Abstract

A multiple transistor module is mounted on a printed circuit board at an angle so that its overall height is such that it does not require larger automation equipment than presently used and so that it does not take up too much area on the printed circuit board. A low-cost multiple transistor module 1 has an aluminum heatsink 2 attached thereto by two brass eyelets 3 to form a unit 4. The eyelets 3, which are a lower cost method than using solid studs or screws and tapped holes, are attached to the module 1 and the heatsink 2 by pick and place equipment of an automated assembly line. Then, the unit 4 is positioned by automated pick and place equipment on a printed circuit board 5 with leads 6 of the unit 4 extending through openings in the printed circuit board 5.

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Method of Mounting Low-Cost Multiple Transistor Modules

A multiple transistor module is mounted on a printed circuit board at an angle so that its overall height is such that it does not require larger automation equipment than presently used and so that it does not take up too much area on the printed circuit board. A low-cost multiple transistor module 1 has an aluminum heatsink 2 attached thereto by two brass eyelets 3 to form a unit 4. The eyelets 3, which are a lower cost method than using solid studs or screws and tapped holes, are attached to the module 1 and the heatsink 2 by pick and place equipment of an automated assembly line. Then, the unit 4 is positioned by automated pick and place equipment on a printed circuit board 5 with leads 6 of the unit 4 extending through openings in the printed circuit board 5. Two of the units 4 may be mounted adjacent each other, if desired, as shown in Fig. 2. The over-all height of each of the units 4 is less than the height limitation of the presently used automation equipment. If the units 4 were mounted vertically rather than at an angle, the height of the units 4 would exceed the height of the presently used automation equipment so that this would necessitate larger automation equipment whereby additional floor space would be needed. If the units 4 were placed in a horizontal position so as to still be within the height limitation of the present automation equipment, a greater area of the printed circuit board 5 w...