Browse Prior Art Database

Vacuum Solder Ring Application Fixture

IP.com Disclosure Number: IPCOM000039968D
Original Publication Date: 1987-Sep-01
Included in the Prior Art Database: 2005-Feb-01
Document File: 2 page(s) / 29K

Publishing Venue

IBM

Related People

Cheng, CJ: AUTHOR [+3]

Abstract

A method to apply solder in a high density pad area on a printed circuit board is described. One of the major efforts in today's electronics industry is to develop high circuit density components. There is no existing established method for reworking the component at the assembly level. The difficulties arise after the substrate gets removed. There is no way to reapply solder on the pads in the removed module area. The method consists basically of two parts: 1. Vacuum pulling and dropping system 2. Pin array As indicated in the figure, the pin array 11 is used to register the solder rings 12. When the vacuum is pulled, solder rings are lifted from the cartridge, inside the cartridge holder onto the registration pins.

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Vacuum Solder Ring Application Fixture

A method to apply solder in a high density pad area on a printed circuit board is described. One of the major efforts in today's electronics industry is to develop high circuit density components. There is no existing established method for reworking the component at the assembly level. The difficulties arise after the substrate gets removed. There is no way to reapply solder on the pads in the removed module area. The method consists basically of two parts:

1. Vacuum pulling and dropping system

2. Pin array As indicated in the figure, the pin array 11 is used to register the solder rings 12. When the vacuum is pulled, solder rings are lifted from the cartridge, inside the cartridge holder onto the registration pins. The location of the registration pins matches that of the pad pattern on the printed circuit board (PCB). Thus, when the pin array vacuum block is moved onto the corresponding pad area, the vacuum is then turned off. The solder ring will sit on the corresponding pad and form a good seat for the C-4 solder ball on the new component. Flux can be used in the module area on the board to enhance the adhesion of the solder ring. The pins are designed so that the solder ring will plug up the hole of the pin array vacuum block once the vacuum is pulled. Thus, only one ring gets picked up in each hole when the vacuum is turned on.

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