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Optical Inspection/Alignment of Multisided Component Connections

IP.com Disclosure Number: IPCOM000039988D
Original Publication Date: 1987-Sep-01
Included in the Prior Art Database: 2005-Feb-01
Document File: 2 page(s) / 46K

Publishing Venue

IBM

Related People

Kohn, H: AUTHOR [+2]

Abstract

Standard practice for the alignment, or inspection, of multisided solder joints on surface-soldered components is using one to three cameras to view adjacent sides, converting the image to an electrical signal, and then correcting the misalignment by driving an X, Y, r table into proper position. While this system works, it requires a cumbersome amount of equipment such as optical cameras, and support equipment that require refocussing with component size change. A method of checking component lead alignment, before and after solder attachment, using only one camera and permitting a view of all sides of a component (even if connection leads are under the component body), is described in the following. (Image Omitted) Shown in Fig.

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Optical Inspection/Alignment of Multisided Component Connections

Standard practice for the alignment, or inspection, of multisided solder joints on surface-soldered components is using one to three cameras to view adjacent sides, converting the image to an electrical signal, and then correcting the misalignment by driving an X, Y, r table into proper position. While this system works, it requires a cumbersome amount of equipment such as optical cameras, and support equipment that require refocussing with component size change. A method of checking component lead alignment, before and after solder attachment, using only one camera and permitting a view of all sides of a component (even if connection leads are under the component body), is described in the following.

(Image Omitted)

Shown in Fig. 1 are three typical surface solder components, a plastic leaded chip connector (PLCC), a ceramic-leaded chip connector (CLCC), and a thin film chip connector (TFCC). Each has connectors on all four edges. In the case of the CLCC and TFCC the connections are underneath the component surface. By using the optical device in Fig. 2, simultaneous viewing and checking of the component leads may be done. As seen in Fig. 2, a camera 1 and attached viewing optics are located over the component center by X, Y movement of servo table 2. Leads 3 of soldered component 4 are now in optical path 5 of the viewing optic device. Image is reflected from mirrors 6 into camera 1 through lens
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