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Method to Form an Electromagnetic Shield on a Component-Populated Electronic Circuit Board

IP.com Disclosure Number: IPCOM000040010D
Original Publication Date: 1987-Sep-01
Included in the Prior Art Database: 2005-Feb-01
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Grice, HA: AUTHOR

Abstract

A method is described which enables an entire circuit board to be shielded for the prevention of electromagnetic radiation using minimum space, material, and labor. It also provides for hermetically sealing the circuit board against oxidation and fungus. Historically, shielding has been a method used for prevention of electromagnetic radiation. The usual shielding method of using metal covers, cans, fingerstock, etc., has proven very difficult to manufacture. The following steps are employed in the new method. 1. Mask the connectors and mounts on the boards. 2. Dip or spray the unmasked area of the board with material which has good thermal conductivity and high electrical re sistance. Use a material which will harden. 3.

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Method to Form an Electromagnetic Shield on a Component-Populated Electronic Circuit Board

A method is described which enables an entire circuit board to be shielded for the prevention of electromagnetic radiation using minimum space, material, and labor. It also provides for hermetically sealing the circuit board against oxidation and fungus. Historically, shielding has been a method used for prevention of electromagnetic radiation. The usual shielding method of using metal covers, cans, fingerstock, etc., has proven very difficult to manufacture. The following steps are employed in the new method. 1. Mask the connectors and mounts on the boards.

2. Dip or spray the unmasked area of the board with material

which has good thermal conductivity and high electrical re sistance. Use a material which will harden. 3. Then dip or spray the board with metallic materials having low

electrical resistance and good thermal transfer

properties to

form a metallic electromagnetic shield over the

entire board.

4. Remove masking from the board and retest.

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