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Controlled Forming of Pins Used With Pin Grid Array Modules

IP.com Disclosure Number: IPCOM000040031D
Original Publication Date: 1987-Sep-01
Included in the Prior Art Database: 2005-Feb-01
Document File: 2 page(s) / 45K

Publishing Venue

IBM

Related People

Lamarche, P: AUTHOR [+2]

Abstract

Pin grid array modules (metallized ceramic technology) have copper pins of cylindrical shape. For stiffness considerations the forming of these pins in order to obtain a "C" shape may be necessary. This invention allows a controlled and repetitive forming of all the pins of a module in one run. As it may be understood from the drawing, after module positioning in a mask, a translation is applied (step 1). Then, a pressure is applied in order to compress the pins (step 2). This pressure is transmitted by a piston guided by a clamp. Lastly, an opposite translation is applied in order to retrieve the initial pattern of the pin tips (step 3). However, the translations may be replaced by clockwise and anti- clockwise rotations, as well. All the directions of forming may be investigated.

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Controlled Forming of Pins Used With Pin Grid Array Modules

Pin grid array modules (metallized ceramic technology) have copper pins of cylindrical shape. For stiffness considerations the forming of these pins in order to obtain a "C" shape may be necessary. This invention allows a controlled and repetitive forming of all the pins of a module in one run. As it may be understood from the drawing, after module positioning in a mask, a translation is applied (step 1). Then, a pressure is applied in order to compress the pins (step 2). This pressure is transmitted by a piston guided by a clamp. Lastly, an opposite translation is applied in order to retrieve the initial pattern of the pin tips (step 3). However, the translations may be replaced by clockwise and anti- clockwise rotations, as well. All the directions of forming may be investigated.

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