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Copper Chloride Etch and Regeneration System

IP.com Disclosure Number: IPCOM000040053D
Original Publication Date: 1987-Sep-01
Included in the Prior Art Database: 2005-Feb-01
Document File: 3 page(s) / 34K

Publishing Venue

IBM

Related People

Bissinger, WD: AUTHOR

Abstract

An etch and regeneration system is described for etching copper from insulating material and for producing finest conductor arrays by the subtractive method, wherein the hydrochloric acid and the water required for regeneration are withdrawn from a first spray chamber of the hydrochloric acid and the DI water cascade, respectively. The quantities of hydrochloric acid and water withdrawn from the spray chambers are automatically replenished by supply lines, so that hydrochloric acid and water are continuously replaced and solutions do not have to be disposed of. The etchant used for copper is a solution of copper(II)chloride, hydrochloric acid and water with a residual content of monovalent copper and, if necessary, a content of alkali chlorides.

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Copper Chloride Etch and Regeneration System

An etch and regeneration system is described for etching copper from insulating material and for producing finest conductor arrays by the subtractive method, wherein the hydrochloric acid and the water required for regeneration are withdrawn from a first spray chamber of the hydrochloric acid and the DI water cascade, respectively. The quantities of hydrochloric acid and water withdrawn from the spray chambers are automatically replenished by supply lines, so that hydrochloric acid and water are continuously replaced and solutions do not have to be disposed of. The etchant used for copper is a solution of copper(II)chloride, hydrochloric acid and water with a residual content of monovalent copper and, if necessary, a content of alkali chlorides. Depending upon the application, the etchant may contain about 80 to 180 g/l of copper in the form of copper(II)chloride, about 8 to 300 ml of 37 percent hydrochloric acid, about 0 to 20 g/l of monovalent copper, and, if necessary, alkaline chloride in a quantity of 0.5 mol/l until the solution is saturated. Regenerants for the etchant are hydrogen peroxide, hydrochloric acid and water, additionally using, if necessary, compressed-air as an oxidant. In addition to the oxidant, hydrochloric acid and water are used for regeneration. As either are also used for the spray and rinse steps in the same system, the quantities of hydrochloric acid and water required for regeneration are withdrawn from the respective spray chambers. Example The figure shows the most important modules of a closed-loop etch and regeneration system, wherein regeneration takes place in etch module
2. The redox potential controlled regeneration uses hydrogen peroxide, hydrochloric acid and water at a particular stoichiometric ratio. Hydrogen peroxide and hydrochloric acid are fed to etch module 2 from intermediate tanks 9 and 10, whereas water at the desired ratio is applied v...