Browse Prior Art Database

Alternative Module Package

IP.com Disclosure Number: IPCOM000040067D
Original Publication Date: 1987-Sep-01
Included in the Prior Art Database: 2005-Feb-01
Document File: 2 page(s) / 28K

Publishing Venue

IBM

Related People

Carden, TF: AUTHOR [+4]

Abstract

Packaging for thermally enhanced modules housing a semiconductor chip typically consists of an external heatsink bonded to an impact extruded cap. For internal thermal enhancement (ITE) either thermal grease or radial finger cooling (RFC) is used. The foregoing packaging concept has limitations, particularly regarding the manufacturability of the cap. A new packaging concept is described in the following. The module consists of a stamped cap 10 which is attached to substrate 11 by crimping. The cap 10 has a hole, or window 12, located directly over a chip 13. The module is then sealed by small shot size edge sealing. A cinderblock heatsink 14 is attached by means of a B staged epoxy 15 which is screened on the bottom side of heatsink 14, except for the ITE contact area.

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Alternative Module Package

Packaging for thermally enhanced modules housing a semiconductor chip typically consists of an external heatsink bonded to an impact extruded cap. For internal thermal enhancement (ITE) either thermal grease or radial finger cooling (RFC) is used. The foregoing packaging concept has limitations, particularly regarding the manufacturability of the cap. A new packaging concept is described in the following. The module consists of a stamped cap 10 which is attached to substrate 11 by crimping. The cap 10 has a hole, or window 12, located directly over a chip 13. The module is then sealed by small shot size edge sealing. A cinderblock heatsink 14 is attached by means of a B staged epoxy 15 which is screened on the bottom side of heatsink 14, except for the ITE contact area. The ITE, in this example RFC 16, is mechanically attached directly to the heatsink 14. After the module is backsealed, the heatsink 14 is assembled to the cap 10 and attached by curing the B staged epoxy. This completes the encapsulation. This arrangement eliminates the thermal resistance of the heatsink-cap attachment epoxy by directly conducting the heat from the chip to heatsink.

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