Browse Prior Art Database

Corkscrew Chip Pull

IP.com Disclosure Number: IPCOM000040120D
Original Publication Date: 1987-Sep-01
Included in the Prior Art Database: 2005-Feb-01
Document File: 2 page(s) / 51K

Publishing Venue

IBM

Related People

Bitaillou, A: AUTHOR [+3]

Abstract

During chip pull test and anlaysis of C4 solder column wettability, the number of samples that can be analyzed is limited by the technique that removes the chip from the substrate. That number of samples which can be analyzed in a given period of time can be easily increased by the implementation of the high speed chip pull procedure described below, which consists of presticking the screw on the chip (Fig. 1), then screwing and pulling with the corkscrew tool (Figs. 2 and 3). - Place a drop of glue on the chip. - Place the clamp on the substrate. - Drop the screw on the chip. - Wait a few minutes to cure glue. - Remove the clamp. - Move the screw into the corkscrew. - Pull the chip by pulling down the two levers of the corkscrew.

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Corkscrew Chip Pull

During chip pull test and anlaysis of C4 solder column wettability, the number of samples that can be analyzed is limited by the technique that removes the chip from the substrate. That number of samples which can be analyzed in a given period of time can be easily increased by the implementation of the high speed chip pull procedure described below, which consists of presticking the screw on the chip (Fig. 1), then screwing and pulling with the corkscrew tool (Figs. 2 and 3). - Place a drop of glue on the chip. - Place the clamp on the substrate. - Drop the screw on the chip.

- Wait a few minutes to cure glue. - Remove the clamp.

- Move the screw into the corkscrew. - Pull the chip by pulling down the two levers of the corkscrew.

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