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Circuit Card/Component Assembly for Universal Circuit Card Design and Testability

IP.com Disclosure Number: IPCOM000040136D
Original Publication Date: 1987-Sep-01
Included in the Prior Art Database: 2005-Feb-01
Document File: 3 page(s) / 58K

Publishing Venue

IBM

Related People

Cook, HC: AUTHOR [+4]

Abstract

Disclosed is a circuit card layout and modular component interconnection scheme that can achieve a single side circuit card layout and interconnection. A chief feature is that all of the electronic components on the circuit card are mounted or attached to a single side or to both sides, but all of the wiring is contained on one side of the card. This reduces greatly the cost of the circuit card since plated through holes, or vias as they are known, are not employed on the circuit card. In addition, a number of universal connection sites for modular components may be provided and the nature and function of the devices or modules placed at the sites can vary as desired. The final interconnection of the devices is left to a centrally located, individually tailored interconnection block or card.

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Circuit Card/Component Assembly for Universal Circuit Card Design and Testability

Disclosed is a circuit card layout and modular component interconnection scheme that can achieve a single side circuit card layout and interconnection. A chief feature is that all of the electronic components on the circuit card are mounted or attached to a single side or to both sides, but all of the wiring is contained on one side of the card. This reduces greatly the cost of the circuit card since plated through holes, or vias as they are known, are not employed on the circuit card. In addition, a number of universal connection sites for modular components may be provided and the nature and function of the devices or modules placed at the sites can vary as desired. The final interconnection of the devices is left to a centrally located, individually tailored interconnection block or card. The figure illustrates a circuit card 1 having on one surface thereof representative component connection sites 2 and 5. The sites 2 employ drilled holes through the card so that the component 3 may be mounted on either the top or the bottom of the card via its leads 4. The component 3 could be a modular high density circuit chip, a single resistor or capacitor or any type of modular logic unit. The interconnection sites 2 are shown for example only. A number of individual leads 8 lead away from the connection sites to a central area of card 1 where they terminate without touching or crossing one another. The component connection sites 5 are plated pads on the surface of the card 1 for interconnection to another type of modular component 6 which utilizes flat leads or tabs 7 instead of holes, such as the connection sites 2. A plurality of individual leads 8 lead away from these tab bonding or surface mount sites 5 as well. Only two groups of representative interconnection sites are shown. The circuit card 1 would be configured with many universally adaptable sites, as desired, and components of any type or description can be bonded to or inserted in the connection sites 5 and 2, respectively, but are not interconnected by the circuit lines 8 since these lines 8 all terminate without connection to one another or touching one another in a central area 9. The final process of interconnecting all of the various components from the numerous sites when populated with the components on the circuit card 1 is achieved by a central interconnector 10 which is individually tailored for the function of the circuit card 1 and the particular selection of components 3, 6, etc., that may be attached thereto. The interconnection block 10 may comprise one or more layers of conductors 11 which may be insulated from one another and interconnected with plated or drilled vias as shown by the larger detail. The conductors 11A and 11C may be on the same or opposite sides of the connector or a layer within the connector
10. Conductor 11B connec...